Specialization: ENGINEERING ELECTRONICS OR COMMUNICATION
Job description:
Job Description: • Well experience in wirebond / diebond machine and responsible for product characterization and qualification of changes and well experience in performing evaluations. • Responsible for quality, yield, cost and cycle time improvement. • Capable to introduce and participate in the new product development and provide input on technical challenges. • Responsible for qualification on different packages (from BU) and its transfer to manufacturing. • Creates, maintains and revises manufacturing documentations (Bonding diagram and specifications, etc.). • Take ownership to work with cross functional team to resolve quality issues • Performs other duties as required by immediate superior from time to time. Job Requirements: • Candidate must possess at least a Bachelor's Degree or Master's Degree in Engineering (Material Science), Engineering (Electrical/Electronic) or equivalent. • Prefer with minimum 2-5 years relevant experiences in semiconductor • Well experience in wire bond machine and process • Responsible in yield and scrap performance improvement • Capable to introduce new product development • Well experience in performing improvement evaluations • Capable to perform disposition of abnormal lot at wire bond area
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