Specialization: ENGINEERING OTHERS
Job description:
Field After Sales Service Engineer (Wire Bonder/Die Bonder/Mold Machine) Based in Melaka, Malaysia Job Description: - Provide on-site field service support to customers.
- Complete assigned tasks within specified timelines.
- Install new equipment and ensure smooth, reliable operation for customer approval.
- Perform inspections and diagnose equipment faults for timely repairs.
- Analyze breakdowns and conduct necessary repairs to meet customer needs.
- Monitor work progress and ensure compliance with specifications.
- Conduct training sessions for customer staff upon request.
- Document and submit maintenance and repair work promptly.
- Attend meetings with customers and provide feedback on outcomes.
- Understand customer needs and maintain strong customer relationships.
Minimum Academic Qualification: - Certificate/Diploma, preferably in Engineering.
- Ideally, 2 to 3 years of experience in the Semiconductor field.
- Fresh graduates will also be considered.
Working Days & Hours: - Five working days (Monday - Friday).
- Flexibility to work on weekends, public holidays, or shifts when necessary - Allowance and replacement day-off provided for such cases.
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