Wafer Dicing Assembly Equipment Engineer

Location: Penang
Job ID: MCN15

Specialization: ENGINEERING MECHANICAL OR AUTOMOTIVE

Job description:

Responsibilities and Tasks:

  • Implement Preventive/Predictive maintenance program
  • Develop equipment maintenance specification
  • Monitor equipment performance key indicators and responsible to meet expectation
  • Provide necessary production support
  • Establish spare inventory system for key equipment
  • Monitor spare cost and drive down liabilities of spare inventories
  • Work with Purchasing to identify critical suppliers and develop 2nd sourcing strategy
  • Identify the key cost drivers and work on cost reduction programs
  • Define, develop and maintain equipment capabilities, strategy and roadmap
  • Maintaining a matrix on equipment capabilities and constraints
  • Work with equipment suppliers to develop new material / capabilities
  • Regularly conduct equipment benchmarking exercise
  • Work with equipment suppliers to develop new capability
  • Work with Package Development team to establish production capabilities for new products

Requirements:

  • Master / Degree in Mechanical, Mechatronics, Electrical & Electronics or related Engineering
  • Minimum 3 years of working experience in semiconductor industry.
  • Knowledge in Die Prep for wafer blade dicing, stealth dicing, laser grooving, edge trimming will be added advantages.
  • Excellent interpersonal, communication and leadership skill with an extremely positive attitude towards working as a team.
  • Broad technical knowledge in problem solving analytical skill & lead an engineering team through innovative process implementation (FMEA, DOE, FDC/APC, DATA ANALYSIS)
  • Self-motivated, possess initiative and ability to work independently
  • Team player with good communication and interpersonal skills


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