Specialization: ENGINEERING ELECTRONICS OR COMMUNICATION
Job description:
Process Engineering Manager (Wire Bond) Job Description - Responsible for organization’s manufacturing assembly processes (wire bond), define product assembly procedures and FMEA.
- Initiate, direct, and coordinate through the efforts of the process engineering group all process activities to ensure optimum use of workers, equipment, materials, and facilities.
- Continue improvement for the Yield and Quality year to year for better cost structure.
- Drive and guide a group of process Engineers to achieve company goal and objective.
Job Responsibilities - Work with R&D team; direct and coordinate the process engineering group activities in the design, development, implementation and improvement of systems, processes, and product assembly procedures.
- Provide planning, direction, and coordination for all process activities to ensure optimum use of workers, equipment, materials, and facilities.
- Plan and establish process engineering projects and follow up on performance against estimates.
- Initiate cost reduction proposals, compile appropriate information, make recommendations for action, and confirm results obtained.
- Manage, through process and procedure, the implementation of product design changes
- Responsible for the identification, source selection, installation, validation, training, and implementation of new equipment and new processes.
- Ensure active consultation with new product development teams regarding manufacturing capabilities and issues related to design for manufacturability, test, and assembly.
- Assist in the preparation of new product cost estimates.
- Define the technical training in manufacturing techniques, methods and processes provided to manufacturing associates.
- Actively seek knowledge of new manufacturing technologies, methods, and techniques.
- Ensure compliance of company policies, procedures, and objectives regarding processes, initiatives, and projects.
- Continue improvement project to drive for yield and quality.
- Coordinate and work with Quality team for the customer complaint and customer visit.
Competency Requirement - At least a Bachelor’s Degree in Electrical, Electronic, Mechanical or related disciplines
- More than 15 years working experience, preferably with 5 years of supervisory experience in semiconductor industry (Wire bonding process)
- Ability to lead and coach a team of more than 10 WB engineers
- Familiar with Management System, coretools, statistical techniques, equipment & tools knowledges and troubleshooting skills
- Good communication and interpersonal skills
- Presentation Skills
- Must be willing to work in Melaka
Interested candidates please reach out to Gan at gan@asiarecruit.com.my or 017-6700722 Only shortlisted candidates will be notified.
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