Wire Bond Process Engineering Manager

Location: Melaka

Job ID: TOD3

Specialization: ENGINEERING ELECTRONICS OR COMMUNICATION

Job description:

Process Engineering Manager (Wire Bond)


Job Description



  • Responsible for organization’s manufacturing assembly processes (wire bond), define product assembly procedures and FMEA.

  • Initiate, direct, and coordinate through the efforts of the process engineering group all process activities to ensure optimum use of workers, equipment, materials, and facilities.

  • Continue improvement for the Yield and Quality year to year for better cost structure.

  • Drive and guide a group of process Engineers to achieve company goal and objective.


Job Responsibilities



  • Work with R&D team; direct and coordinate the process engineering group activities in the design, development, implementation and improvement of systems, processes, and product assembly procedures.

  • Provide planning, direction, and coordination for all process activities to ensure optimum use of workers, equipment, materials, and facilities.

  • Plan and establish process engineering projects and follow up on performance against estimates.

  • Initiate cost reduction proposals, compile appropriate information, make recommendations for action, and confirm results obtained.

  • Manage, through process and procedure, the implementation of product design changes

  • Responsible for the identification, source selection, installation, validation, training, and implementation of new equipment and new processes.

  • Ensure active consultation with new product development teams regarding manufacturing capabilities and issues related to design for manufacturability, test, and assembly.

  • Assist in the preparation of new product cost estimates.

  • Define the technical training in manufacturing techniques, methods and processes provided to manufacturing associates.

  • Actively seek knowledge of new manufacturing technologies, methods, and techniques.

  • Ensure compliance of company policies, procedures, and objectives regarding processes, initiatives, and projects.

  • Continue improvement project to drive for yield and quality.

  • Coordinate and work with Quality team for the customer complaint and customer visit.


Competency Requirement



  • At least a Bachelor’s Degree in Electrical, Electronic, Mechanical or related disciplines

  • More than 15 years working experience, preferably with 5 years of supervisory experience in semiconductor industry (Wire bonding process)

  • Ability to lead and coach a team of more than 10 WB engineers

  • Familiar with Management System, coretools, statistical techniques, equipment & tools knowledges and troubleshooting skills

  • Good communication and interpersonal skills

  • Presentation Skills

  • Must be willing to work in Melaka


Interested candidates please reach out to Gan at [email protected] or 017-6700722


Only shortlisted candidates will be notified.



AsiaRecruit CV